Conference Agenda
| Session | ||
Ultrashort Pulse – Drilling & Micromachining
| ||
| Presentations | ||
2:00pm - 2:20pm
Relation between subsurface formation mechanism and ablation efficiency during femtosecond laser processing of polycrystalline alumina 1Keio University, Japan; 2NGK Insulators, Ltd., Japan 2:20pm - 2:40pm
Study of bottom-up column formation in bulk silicon initiated at silicon-air and silicon-glass interfaces by ultrafast laser processing 1Université de Bordeaux-CNRS-CEA, CELIA UMR 5107, 33405 Talence, France; 2AMPLITUDE, Cité de la Photonique, 33600 Pessac, France; 3ALPhANOV, Rue François Mitterrand, 33400 Talence, France; 4Friedrich Schiller University Jena, Abbe Center of Photonics, Institute of Applied Physics, Albert-Einstein-Straße 15, Jena 07745, Germany; 5Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Center of Excellence in Photonics, Albert-Einstein-Straße 7, Jena 07745, Germany 2:40pm - 3:00pm
Laser removal of residual layers generated by atmospheric plasma jet etching of optical glass Leibniz-Institut für Oberflächenmodifizierung (IOM), Germany 3:00pm - 3:20pm
Advancing Process Stability for Next‑Generation Ultrafast Laser Micromachining (Industrial Talk) GFH GmbH, Germany | ||