Session | |
Poster Session 2: Posters - Buffet - Expo
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Presentations | |
Novel Method to Speed-Up Power Module Optimisation Using Geometrical Rule Checking of Electrical and Thermal Parameter 1TU Dublin, Irland; 2Vincotech Hungária Kft., Hungary; 3Siemens EGD GmbH, Germany; 4Hochschule Darmstadt, Germany Integration of 3D Rogowski sensor within power module 1Université de Technologie de Tarbes, France; 2DEEP Concept, France Inverse Order Packaging (invPack): Power Module Packaging Technique Using Standard Fabrication Processes and Achieving Improved Performance at Lower Cost 1University of Nottingham, United Kingdom; 2DEEP Concept, France; 3MTAL GmbH, Switzerland; 4mqSemi AG, Switzerland; 5Cyprus University of Technology, Cyprus Comprehensive Common Mode Equivalent Circuit Modeling of Dual Active Bridge Converters under Asymmetric Conditions 1CEA, France; 2Grenoble INP / UGA Data-based Circuit Design Method for Class Φ Resonate Converters 1Aalto University, Finland; 2Aalborg University, Denmark Dual-Active Bridge Sequential Pareto Optimization for Fast Pre-Design and Final Component Selection 1Paderborn University, Germany; 2University of Siegen, Germany Operating Frequency Range of Air Core Magnetic Inductors for Very High Frequency Power Converters Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab, 38000 Grenoble, France A Direct and systematic design methodology for sizing class phi2 inverter Laboratoire Ampère, France A Current Ripple Driven Design Methodology for Filter Inductors in Dynamic Power Converters using Adaptive Delta-Sigma Modulation Reutlingen University, Germany Tunable isolated gate driver supply for automated switching loss measurement of Power Field Effect Transistors LAPLACE, Université de Toulouse, CNRS, INPT, UPS, Toulouse, France, France Switching loss reduction with commutation loop layout optimization for GaN devices with low output capacitance Reutlingen University, Germany Mission Profile-Based Online Remaining Useful Life Estimation of Power MOSFETs for Electric Vehicles using CARLA 1Institute of Robust Power Semiconductor Systems, University of Stuttgart, Stuttgart, Germany; 2Institute for Power Electronics and Electrical Drives, University of Stuttgart, Stuttgart, Germany Validating Junction Temperature Estimation of Power Modules Using Generative AI and Fiber Optic Sensing 1Research Division Power Electronics, Silicon Austria Labs GmbH, Austria; 2PEMD Laboratory, DPIA, University of Udine, Udine, Italy |